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AS1339
Datasheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in Electrical Character-
istics on page 5 is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Table 2. Absolute Maximum Ratings
Parameter
IN1A, IN1B, IN2 to AGND
PAA, PAB, PA_EN, TEST, REFIN,
NC to AGND
LDO1, LDO2, EN1, EN2 to AGND
REFIN Common-Mode Range
IN2 to IN1B/IN1A
PGND to AGND
LX Current
Bypass Current
Human Body Model
Storage Temperature Range
Package Body Temperature
Min
-0.3
-0.3
-0.3
0
-0.3
-0.3
-65
1
Max
+7
V IN1A /
V IN1B +
0.3
V IN2 +
0.3
V IN
+0.3
+0.3
0.8
1.6
+150
+260
Units
V
V
V
V
V
V
A RMS
A RMS
kV
oC
oC
Comments
HBM MIL-Std. 883E 3015.7 methods
The reflow peak soldering temperature (body
temperature) specified is in accordance with
IPC/JEDEC J-STD-020D “Moisture/Reflow
Sensitivity Classification for Non-Hermetic Solid
State Surface Mount Devices”.
Continuous Power Dissipation
P D-MAX
0.75
W
T A = +65oC; derate 12.5mW/oC above +65oC
Junction Temperature (T J ) Range
-40
+125
oC
Ambient Temperature (T A ) Range
-40
+85
oC
In applications where high power dissipation
and/or poor package thermal resistance is
present, the maximum ambient temperature
may have to be derated.
Maximum ambient temperature (T A-MAX ) is
dependent on the maximum operating junction
temperature (T J-MAX-OP = 125oC), the maximum
power dissipation
of the device in the application (P D-MAX ), and the
junction-to ambient thermal resistance of the
part/package in the application ( θ JA ), as given by
the following
equation: T A-MAX = T J-MAX-OP – ( θ JA × P D-MAX ).
Revision 1.05
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